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Devices

GlobalFoundries–TSMC silicon interposer deal adds a U.S. source for AI packaging, with the real test in 2028

GlobalFoundries and TSMC have signed a $2 billion, five-year agreement to build a U.S. source of silicon interposers…

ByByAva Davis Oct 9, 2026

Rapidus CORE Launches a 17-Company Design Ecosystem for Japan’s $15 Billion 2nm Foundry Push

Rapidus has unveiled CORE, a 17-associate design framework meant to make its planned 2nm foundry usable for customers…

ByByEmily Johnson Oct 8, 2026

Qualcomm Renews Apple Patent License, Highlighting the Split Between Modem Supply and Cellular Royalties

Qualcomm says it has renewed its global patent license agreement with Apple effective April 1, 2027, preserving a…

ByByIsabella Garcia Sep 27, 2026

Google’s First Project Suncatcher Orbital Test Makes AI-in-Space a Real Engineering Question

Google says a TPU-equipped prototype will fly on SpaceX’s Transporter-18 rideshare with Planet, moving Project Suncatcher from concept…

ByByIsabella Garcia Sep 25, 2026
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Applied Materials Unveils $5 Billion EPIC Center in Silicon Valley to Test a Faster AI-Chip R&D Model

Applied Materials has opened its EPIC Center in Sunnyvale as a roughly $5 billion collaborative semiconductor R&D hub.…

ByByIsabella Garcia Oct 12, 2026

Grain Management’s 800 MHz spectrum sale gives SpaceX a low-band path into U.S. wireless

SpaceX agreed to buy Grain Management’s nationwide 800 MHz licenses, giving Starlink Mobile a potential terrestrial coverage layer.…

ByByMichael Smith Oct 10, 2026